Alison Engwall

Portrait of  Alison Engwall

  • Title
    Postdoctoral Researcher
  • Email
  • Phone
    (925) 423-1387
  • Organization
    Not Available

Research Interests

  • Thin film growth and residual stress development
  • High power impulse magnetron sputtering (HiPIMS)
  • Advanced materials processing and characterization

Ph.D., Engineering, Brown University, 2018

M.S., Engineering, Brown University, 2012

B.S., Materials Science and Engineering, Massachusetts Institute of Technology, 2009

  1. A.M. Engwall, S.J. Shin, J. Bae, Y.M. Wang, Enhanced properties of tungsten films by high-power impulse magnetron sputtering, Surf. Coat. Technol. (2019).
  2. E. Chason, A.M. Engwall, Z. Rao, T. Nishimura, Kinetic model for thin film stress including the effect of grain growth, J. Appl. Phys. 123, 185305 (2018).
  3. A.M. Engwall, Z. Rao, E. Chason, Residual Stress in Electrodeposited Cu Thin Films: Understanding the Combined Effects of Growth Rate and Grain Size, J. Electrochem. Soc. 164, D828 (2017).
  4. A.M. Engwall, Z. Rao, E. Chason, Origins of residual stress in thin films: Interaction between microstructure and growth kinetics, Mater. Des. 110, 616 (2016).
  5. E. Chason, A.M. Engwall, Relating residual stress to thin film growth processes via a kinetic model and real-time experiments, Thin Solid Films 596, 2 (2015).
  6. E. Chason, A.M. Engwall, C. Miller, C.-H. Chen, A. Bhandari, S. Soni, S. Hearne, L. Freund, B. Sheldon, Stress evolution during growth of 1-D island arrays: Kinetics and length scaling, Scripta Mater. 97, 33 (2015).
  7. E. Chason, J. Shin, C.-H. Chen, A.M. Engwall, C. Miller, S. Hearne, L. Freund, Growth of patterned island arrays to identify origins of thin film stress, J. Appl. Phys115, 123519 (2014).
  • William N. Findley Award, Brown University School of Engineering, 2017
  • Brown University Graduate Fellowship, 2011