Ph.D., Materials Science and Engineering, University of Illinois at Urbana-Champaign, 2009
B.S., Chemistry, St. Norbert College, 2003
B.S., Mathematics, St. Norbert College, 2003
Dr. Duoss is currently a Member of the Technical Staff at Lawrence Livermore National Laboratory, where he conducts research in the areas of advanced materials and manufacturing combined with micro-architected design.
Additive manufacturing, 3D printing, printed electronics, functional materials, colloids and complex fluids, soft matter, microfluidics, microencapsulation, emulsion science
E. B. Duoss, T. H. Weisgraber, K. Hearon, C. Zhu, W. Small IV, T. R. Metz, J. J. Vericella, H. D. Barth, J. D. Kuntz, R. S. Maxwell, C. M. Spadaccini, and T. S. Wilson, “Three-Dimensional Printing of Elastomeric, Cellular Architectures with Negative Stiffness,” accepted to Advanced Functional Materials, available as Early View (2014). Cover article.
X. Zheng, H. Lee, T. H. Weisgraber, M. Shusteff, J. R. Deotte, E. B. Duoss, J. D. Kuntz, M. M. Biener, S. O. Kucheyev, Q. Ge, J. Jackson, N. X. Fang, and C. M. Spadaccini, “Ultra-light, Ultra-stiff Mechanical Metamaterials,” Science344, 6190, 1373–1377 (2014).
J. J. Adams, E. B. Duoss (co-first author), T. F. Malkowski, M. J. Motala, B. Y. Ahn, R. G. Nuzzo, J. T. Bernhard, and J. A. Lewis, “Conformal Printing of Electrically Small Antennas on Three-Dimensional Surfaces,” Advanced Materials23, 1335–1340 (2011). Cover article.
X. Guo, H. Li, B. Y. Ahn, E. B. Duoss, K. J. Hsia, J. A. Lewis, and R. G. Nuzzo, “Two and Three-Dimensional Folding of Thin Film Single-Crystalline Silicon for Photovoltaic Power Applications,” Proceedings of the National Academy of Sciences106, 48, 20149–20154 (2009). Cover article.
B. Y. Ahn, E. B. Duoss, M. J. Motala, X. Guo, S.-I. Park, Y. Xiong, J. Yoon, R. G. Nuzzo, J. A. Rogers, and J. A. Lewis, "Omnidirectional Printing of Flexible, Stretchable, and Spanning Silver Microelectrodes," Science323, 5921, 1590–1593 (2009).
E. B. Duoss, M. Twardowski, and J. A. Lewis, "Sol-Gel Inks for Direct-Write Assembly of Functional Oxides," Advanced Materials19, 21, 3485–3489 (2007).