Dr. Duoss is currently a Member of the Technical Staff at Lawrence Livermore National Laboratory, where he conducts research in the areas of advanced materials and manufacturing combined with micro-architected design.
Additive manufacturing, 3D printing, printed electronics, functional materials, colloids and complex fluids, soft matter, microfluidics, microencapsulation, emulsion science
Ph.D., Materials Science and Engineering, University of Illinois at Urbana-Champaign, 2009
B.S., Chemistry, St. Norbert College, 2003
B.S., Mathematics, St. Norbert College, 2003
E. B. Duoss, T. H. Weisgraber, K. Hearon, C. Zhu, W. Small IV, T. R. Metz, J. J. Vericella, H. D. Barth, J. D. Kuntz, R. S. Maxwell, C. M. Spadaccini, and T. S. Wilson, “Three-Dimensional Printing of Elastomeric, Cellular Architectures with Negative Stiffness,” accepted to Advanced Functional Materials, available as Early View (2014). Cover article.
X. Zheng, H. Lee, T. H. Weisgraber, M. Shusteff, J. R. Deotte, E. B. Duoss, J. D. Kuntz, M. M. Biener, S. O. Kucheyev, Q. Ge, J. Jackson, N. X. Fang, and C. M. Spadaccini, “Ultra-light, Ultra-stiff Mechanical Metamaterials,” Science 344, 6190, 1373–1377 (2014).
J. J. Adams, E. B. Duoss (co-first author), T. F. Malkowski, M. J. Motala, B. Y. Ahn, R. G. Nuzzo, J. T. Bernhard, and J. A. Lewis, “Conformal Printing of Electrically Small Antennas on Three-Dimensional Surfaces,” Advanced Materials 23, 1335–1340 (2011). Cover article.
X. Guo, H. Li, B. Y. Ahn, E. B. Duoss, K. J. Hsia, J. A. Lewis, and R. G. Nuzzo, “Two and Three-Dimensional Folding of Thin Film Single-Crystalline Silicon for Photovoltaic Power Applications,” Proceedings of the National Academy of Sciences 106, 48, 20149–20154 (2009). Cover article.
B. Y. Ahn, E. B. Duoss, M. J. Motala, X. Guo, S.-I. Park, Y. Xiong, J. Yoon, R. G. Nuzzo, J. A. Rogers, and J. A. Lewis, "Omnidirectional Printing of Flexible, Stretchable, and Spanning Silver Microelectrodes," Science 323, 5921, 1590–1593 (2009).
E. B. Duoss, M. Twardowski, and J. A. Lewis, "Sol-Gel Inks for Direct-Write Assembly of Functional Oxides," Advanced Materials 19, 21, 3485–3489 (2007).